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£3.5m Boost for UK Future Telecoms as CHEDDAR Hub Advances 6G Research
The University of Glasgow is playing a key role in a major UK-wide research initiative to shape the future of telecommunications, which has just received a £3.5 million funding boost.
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Glasgow AI Startup Secures Funding Boost to Expand in Finance Sector
Glasgow-based AI firm FD Intelligence has secured a £200,000 investment from UKSE, a subsidiary of Tata Steel, to fast-track its expansion into the financial services sector.
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University of Glasgow Innovation Bridges the Gap Between Zoo Animals and Visitors
Last summer, computing science experts from the University of Glasgow teamed up with zookeepers at Blair Drummond Safari Park to test ‘SensorySafari’, a prototype interactive system which enabled red-ruffed lemurs and humans to share linked multisensory experiences.
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Glasgow Spinout RX Watt Develops Battery-Free Rail Sensors to Boost Sustainable Transport
A new generation of battery-free sensors, developed by University of Glasgow spinout RX Watt Ltd, could revolutionise rail carriage maintenance by making condition monitoring more cost-effective, environmentally sustainable, and simpler to deploy.
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Glasgow Researchers to Shape the Future of Smartphone Control with Eye-Tracking Technology
Insights from a new study focused on widening the use of eye-tracking as a control method for mobile devices could offer a sharper view of the smartphones of the future.
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Strathclyde Research Explores Technology to Support People with Dementia
The use of technology to help people living with dementia to remain independent for longer is to be explored in new research. 
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University of Strathclyde’s StrathApp Wins National Award for Digital Innovation
StrathApp provides students with easy access to timetables and assessment results, enables library entry via a digital student card, supports campus navigation and connects users to University support services – all via mobile devices.
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NMIS to Lead Scotland’s Semiconductor Innovation with Advanced Packaging Facility
New development could cut chip packaging process from months to just days for UK firms
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